HandsKit SP-628 Solder Paste, 35 g is a ready-to-use tin-lead solder paste with silver added, designed for mounting SMD components, repairing electronics and performing precision soldering work. The paste is supplied in a convenient syringe, which allows you to dose the material directly onto the contact pads of printed circuit boards.
HandsKit SP-628 is made of the Sn62.8/Pb36.8/Ag0.4 alloy, which contains 62.8% tin, 36.8% lead and 0.4% silver. The melting point is 181°C, and the solder particle size is 20–38 μm. The paste has a viscous consistency and a gray color, which ensures convenient application to the soldering points.
🔥 Melting point 181°C
HandsKit SP-628 solder paste has a melting point of 181°C, making it suitable for mounting electronic components using a heat gun, soldering station, or other suitable reflow soldering equipment.
When heated, the metal particles of the solder melt and form a solder joint between the component contacts and the printed circuit board. To obtain a high-quality result, it is necessary to ensure sufficient heating of the soldering point and adhere to the temperature regime recommended for the components.
⚙️ Composition of solder Sn62.8/Pb36.8/Ag0.4
The composition of SP-628 solder paste includes a three-component metal alloy:
- Tin (Sn) — 62.8% — the main component of the solder.
- Lead (Pb) — 36.8% — a component of the tin-lead alloy, which affects its melting point and properties.
- Silver (Ag) — 0.4% — an alloying additive to the solder.
This composition makes tin-lead Solder paste with silver suitable for assembly and repair of electronic components, where the use of lead-containing solders is allowed.
🔬 Finely dispersed solder 20–38 μm
HandsKit SMD soldering paste contains metal particles 20–38 μm in size. The fine fraction allows you to apply solder to small contact pads and use it for mounting miniature electronic components.
The viscous consistency helps to place the paste directly in the soldering area, and after heating, the solder particles form a metal connection.
💉 Convenient packaging in a 35 g syringe
SP-628 solder paste in a syringe allows you to control the amount of material applied. This format is especially convenient when repairing electronics, local mounting of SMD components and performing work with small contacts.
The mass of the paste is 35 g. The syringe simplifies the application of solder to individual areas of the PCB and helps reduce excess material use.
📋 HandsKit SP-628 Specifications
| Manufacturer | HandsKit |
| Model | SP-628 |
| Type | Solder Paste with Solder |
| Alloy Composition | Sn62.8 / Pb36.8 / Ag0.4 |
| Tin content (Sn) | 62.8% |
| Lead content (Pb) | 36.8% |
| Silver content (Ag) | 0.4% |
| Melting temperature | 181°C |
| Solder particle size | 20–38 μm |
| Color | Gray |
| Consistency | Viscose paste |
| Weight | 35 g |
| Packaging | Syringe |
| Purpose | Mounting SMD components, electronics repair, soldering contacts and wires |
🛠️ Where is SP-628 solder paste used
Paste for Soldering SMD components HandsKit SP-628 is used when mounting electronic components on printed circuit boards, restoring contacts and repairing radio electronic equipment.
- Mounting SMD components on printed circuit boards.
- Repair of electronic modules and boards.
- Soldering contact pads.
- Mounting and replacing small electronic components.
- Soldering of radio component leads.
- Connecting wires of different cross-sections.
- Repair of connectors and electrical contacts.
- Radio amateur and installation work.
✔ Advantages of HandsKit SP-628 solder paste
- Ready to use — the paste already contains metal particles solder.
- Melting temperature 181°C - suitable for appropriate soldering processes.
- Silver-added alloy — Sn62.8/Pb36.8/Ag0.4.
- Fine particles 20–38 μm — for application to small contact areas.
- Viscose consistency — convenient for local application.
- 35 g syringe — allows you to dose the required amount of material.
- Universal application — SMD assembly, board repair, soldering wires and contacts.
🔧 Recommendations for use
Before applying Sn62.8/Pb36.8/Ag0.4 solder paste, clean the contact surfaces from dirt and oxidation. Apply a small amount of paste to the soldering point, position the component and heat the joint evenly until the solder melts.
The melting point of 181°C does not mean that the temperature of the heating tool should be exactly this value. The actual soldering mode depends on the heat capacity of the board, components, heating method and other conditions.
⚠️ Safety precautions
Warning! HandsKit SP-628 solder paste contains 36.8% lead in the metal alloy. When working, it is necessary to follow safety rules, avoid contact of the paste with food, do not touch your face with dirty hands and wash your hands thoroughly after use.
Soldering should be performed in a well-ventilated area with proper removal of solder fumes. Do not allow the paste to get into your eyes or mucous membranes. Keep the material in a tightly closed package, out of reach of children.
HandsKit SP-628 35 g is a solder paste in a syringe based on an alloy of tin, lead and silver with a melting point of 181°C. Finely dispersed solder 20–38 microns and a viscous consistency make it a convenient material for mounting SMD components, repairing electronics and performing precise soldering work.
You can buy solder paste with solder HandsKit SP-628, Sn62.8/Pb36.8/Ag0.4, 181°C, 35 g at the indicated price in the WST online store.
The photo of the product may differ slightly from the actual appearance.