Thermal gasket Halnziye HY100 — is a high-quality thermal conductive material designed to fill micro-cavities between electronic components and heat sinks. With an optimal thickness of 0.5 mm and a size of 100×100 mm, the gasket is suitable for a wide range of applications, including processors, video cards, memory modules, chipsets and other sensitive elements.
✔ Advantages of thermal gasket HY100:
➤ High thermal conductivity – effective cooling
➤ Flexible and soft structure – perfectly fills gaps
➤ Electrical insulation – safe for sensitive components
➤ Universal size – can be cut to the desired shape
➤ Stable quality from Halnziye – reliable brand in the field of cooling
⚒ Technical specifications:
| Characteristics | Values |
|---|---|
| Model | Halnziye HY100 |
| Size | 100×100 mm |
| Thickness | 0.5 mm |
| Thermal conductivity | High (the exact value can be specify) |
| Elasticity | High |
| Dielectric strength | Yes |
| Color | Gray / Blue (depending on the batch) |
| Temperature range | -40°C ~ +200°C |
| Purpose | For computer components, microcircuits, radiators |
🔧 Application:
✔ Processors and GPUs of video cards
✔ Power supplies on motherboards
✔ RAM with cooling
✔ Power modules, chips, controllers
✔ Cooling systems in laptops, telecommunications equipment
✔ 3D printers, inverters, LED drivers
⚠ Please note: The image of the product may differ from the real appearance, but this does not affect the functionality. The real photo is available upon request. The product can be exchanged or returned, the shipping costs are covered by the buyer.
【Place an order for the Halnziye HY100 100×100×0.5 mm thermal pad in the WST store – temperature stability at a favorable price.】