HY910 — it is an effective heat-conducting glue that provides a reliable connection of components due to its high thermal conductivity and strength when drying.
Main characteristics:
- Type of glue: Thermally conductive
- Color: White
- Consistency: Sour cream
- Weight of contents: 5 g
- Weight with packaging: 8 g
- Packaging: Vacuum packed aluminum tube with a screw cap
Technical characteristics:
- Coefficient of thermal conductivity: > 0.975 W/m-K
- Thermal resistance: < 0.246 °C·in²/W
- Specific weight: > 2.0
- Evaporation: 0.001%
- Turnover: 0.05%
- Dielectric constant: 5.1
- Breaking strength: 2 MPa
- Maximum temperature: -50 ~ 340 °C
- Working temperature: -30 ~ 300 °C
- Glue setting time: 3 minutes
- Full drying time: 12 hours
Advantages:
- Non-flammable: Guarantees safety during use.
- Does not cause corrosion: Suitable for long-term use.
- Convenient packaging: A tube with a plastic cap ensures that the glue remains liquid and easy to reuse.
- High thermal conductivity: Provides efficient heat dissipation, making it ideal for mounting LEDs, chips, transistors and other components.
- Simplicity of application: It is applied in a thin layer on a degreased surface, which ensures ease of use.
Application:
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CPU or Memory Heatsink Mounting: The HY910 is ideal for situations where using thermal paste and mounts is difficult or inefficient. Thermal adhesive ensures reliable attachment of the radiator to the processor or memory modules, improving heat dissipation and ensuring stable operation of the computer under load.
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Installation of LEDs on radiators: Glue is used for reliable and quick fixing of powerful LEDs on heat-dissipating radiators. This is important for efficient heat removal from LEDs, which ensures their long-term and stable operation.
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Mounting power components: HY910 is also suitable for mounting power components such as transistors and chips on heatsinks. Thanks to its high thermal conductivity, it helps to maintain optimal temperatures of the components, preventing them from overheating.
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Fastening of thermal sensors and thermistors: It is used for reliable fastening of thermal sensors, thermistors and thermal fuses to the surface to be measured. This allows for accurate temperature measurements and effective monitoring of thermal conditions.
Application:
- Degrease the surface to which the glue will be applied to ensure good adhesion.
- Apply a thin, even layer of glue to one of the surfaces.
- Lightly press the components against the surface to ensure even contact.
- Allow the glue to dry for 3 minutes to surface dry and 12 hours to dry completely.
Buy thermal adhesive HY910 in the WST online store and take advantage of quality hot melt adhesives for your technical needs. Our specialists are always ready to help you choose the right product and ensure fast delivery.